Semicon Sp z o.o.
Jacek Tomaszewski
Short Description

Semicon Sp. z o.o. has been operating in the electronics industry for over 30 years. We have a wide and complementary offer of products and services. We use the latest technologies while observing global standards regarding quality assurance, environment protection, health, and product safety. Our team consists of over 100 people across five departments.

Products & Services


  • Electronic and electromechanical components from LEMO, Schurter, iC Haus, Omnetics, VPT Inc., Stäubli (PV connectors)…
  • Materials for the electronics and aerospace industry from 3M, Wacker, Electrolube, CRC, Momentive, Fujipoly…
  • Measurement tools and accessories for the electronics industry
  • Semiconductor materials, pure metals, targets.

PCB and electronic devices assembly services

  • Technologies: SMT, THT, COB (wire bonding), PoP, Hot-Bar
  • Completing components, PCBs, and production materials
  • Assembly in accordance with IPC requirements – class 2 and 3
  • Cleaning and ionic contamination tests of PCBs
  • Selective coating of PCBs
  • Laser cutting PCBs, removing copper and masks
  • AOI inspection
  • X-Ray inspection and analysis
  • ICT and functional tests
  • Control of the component and PCB supply chains
  • Servicing electronic systems and reballing
  • Qualified personnel – IPC certificates.

Laser cutting of SMT stencils

  • VectorGuard™ stencils (ASM-DEK license)
  • Stencils in aluminium frames
  • Stretching frames for Zelflex stencils, VectorGuard™
  • Squeegee blades
  • Closets for storing stencils.

Material converting

  • Cutting industrial tapes
  • CO2 laser plotter, oscillating knife cutter
  • Die-Cut and Kiss-Cut
  • Distribution of materials from 3M, Saint Gobain, Tesa, IPG.

Designing and manufacturing laser modules – optoelectronics

  • Laser modules – line, point, crosshair
  • For MV (Machine Vision) systems
  • Laser barriers.


TD 1 On Board Data Systems
TD 13 Automation, Telepresence & Robotics
TD 16 Optics
TD 17 Optoelectronics
TD 21 Thermal
TD 24 Material & Processes
More Info

Participation in research projects

  • GreenRose (FP6) – the implementation of RoHS Directive. Poland’s first use of lead-free soldering in the production of electronic products.
  • Tele-Ekg (FP6) – implementing lead-free soldering in the production of medical apparatus.
  • Diamond, Radi-Cal (FP7) – Development of two-dimensional monolithic CVD semiconductor arrays that allow radiation dosimetry systems to precisely measure the radiation dose in radiotherapy solutions.
  • ChipCheck (FP7) – creating an automatic and fast Roentgen inspection system to detect counterfeit electronic components.
  • µBGA (FP7) – creating a production technology of balls below 150μm for BGA.
  • POIG – ”Innovative technologies for advanced surface mounting (SMT) of printed circuit boards”
  • SustainablySMART (H2020) – creating a technology enabling re-use of electronic components without destroying them.
  • POIR – “Innovative technologies for mounting components on FLEX surfaces in critical applications, the Internet of Things, and Industry 4.0 systems”
  • POIR – “Designing a medical device for round-the-clock collection and analysis of urine”.


  • ISO 9001:2015
  • ISO 14001:2015
  • ISO 13485:2016
  • AQAP 2110:2016
  • AS 9120-rev. B.

Affiliated company: PB Technik Sp. z o.o. ( – materials, devices, and technologies for the electronics industry.